Understanding National Technology Roadmaps
July 23, 2003 * Northbrook, IL * 8:30 am-5:00 pm
In an era of global competitiveness, companies are facing increasing pressure to cut costs and yet still produce innovative products. This action forces them to take an introspective look at their capabilities, business strategies, technology needs and competitive posture in the world market. While a myriad of strategies are being employed to help companies succeed, one popular strategy is roadmapping. More than a dozen electronics industry roadmaps have been published-many of which will be covered in this course. Attendees will be shown the key components of roadmapping and mechanisms for translating industry roadmaps into practical solutions that work.
You'll focus on the following:
*Basic knowledge of national technology roadmapping
*North American roadmaps
*IPC's national technology roadmaps
*International technology roadmaps
*NEMI's national technology roadmaps
*SIA's international technology roadmap for semiconductors
*The basis and purpose of roadmaps
*Types of resources used to develop a roadmap
Who Should Attend
Senior managers who are charged with charting the direction their company will take and where future investments will be made, will benefit from this course. Roadmapping provides a common structure, vocabulary and means of comparison that enhances and provides context for strategic planning. For senior managers without scientific and engineering backgrounds, roadmapping can provide an especially valuable entrée into where the electronics manufacturing industry is headed and how they can help their company succeed.
About IPC
IPC is an international trade association dedicated to furthering the competitive excellence and financial success of its members in the Printed Circuit Board/Interconnect Manufacturing Services Industry and Electronic Manufacturing Services. With over 2300 members, IPC devotes resources to management improvement, technology enhancement programs, and standards covering design, manufacture, assembly and test of PCBs and electronic assemblies.
About the Instructor
For 35 years, John T. (Jack) Fisher has been in the PCB industry, having worked at both IBM and most recently at ITRI (Interconnect Technology Research Institute). While at IBM, Mr. Fisher held several senior management and staff positions in maintenance, manufacturing and engineering in both Endicott, N.Y. and Austin, TX. He is a 31-year veteran of IBM's technology manufacturing and development organizations and has managed every PCB operation, including the impregnation of reinforcement fabric. Jack was elected Chairman of the Technical Council of the Board of Directors at ITRI before being hired as Chief Technical Officer. Mr. Fisher received IPC's 1996 Chairman of the Board Award for his work to improve PCB interconnect technology. He has authored one book, written numerous papers for trade journals and conferences and is a member of PC FAB's editorial review board.
Registration
This workshop will be held at IPC Headquarters, 2215 Sanders Road, Northbrook, IL. The fee for this course is $395 for IPC members and $495 for non-members. We will begin at 9:00 am (with onsite sign-in and registration starting at 8:30 am) and will conclude by 5:00 pm. Limited seating is available, so please register for this seminar by July 11, 2003. You may duplicate the registration form below if you wish to register additional participants. If you have questions, or if the registration deadline has passed, contact an IPC registration representative at 847-790-5361. The registration fee includes refreshments, course material and lunch.
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