For goodness sake! Can we PLEASE have less html and more subject titles?
Thanks.
Brian
Walters, Karen wrote:
>
>
> Can anyone reference for me the the IPC SPEC that states what
> the pad surface area requirement is to the weight of the
> packaged device. We may be having an issue with a floating
> component during reflow. Please also provide the ratio if
> anyone knows it off hand.
>
> thanks
>
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