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July 2003

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Sender:
TechNet <[log in to unmask]>
X-To:
Frank L Norman <[log in to unmask]>
Date:
Mon, 28 Jul 2003 14:37:59 -0400
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, "Wenger, George M." <[log in to unmask]>
Subject:
Re: Wave solder process issue on ENIG pwa
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"Wenger, George M." <[log in to unmask]>
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Frank,

 

Did you do any characterization of the boards before assembly?  Do you know what the immersion gold thickness was on the ENIG boards?  Did you do solderability testing before or after stressing the boards?  Do you have any boards left that you could use to characterize the surface finish on the boards?



	-----Original Message----- 

	From: Frank L Norman [mailto:[log in to unmask]] 

	Sent: Mon 7/28/2003 1:26 PM 

	To: [log in to unmask] 

	Cc: 

	Subject: [TN] Wave solder process issue on ENIG pwa

	

	

	 

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