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June 2003

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Subject:
Re: BGA substrate pad
From:
Tonglong Zhang <[log in to unmask]>
Reply To:
[log in to unmask]
Date:
Thu, 5 Jun 2003 11:11:41 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (83 lines) 
In addition, a few other factors:

Routing, potential shorting between balls (preferred smaller pads), shear
strength (larger, the better), impedance matching, etc.

Rgds



Tonglong Zhang
Staff Engineer
IC Packaging Engineering
Broadcom  Corporation





-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Misner, Bruce
Sent: Thursday, June 05, 2003 7:39 AM
To: [log in to unmask]
Subject: Re: [TN] BGA substrate pad


The reason is to prevent ball collapse which maintains BGA standoff height
for improved thermal cycling reliability.

Regards,
Bruce Misner

-----Original Message-----
From: Lum Wee Mei [mailto:[log in to unmask]]
Sent: Thursday, June 05, 2003 3:36 AM
To: [log in to unmask]
Subject: [TN] BGA substrate pad


Hello,

Just wonder anyone can provide the reason or how the pad on the BGA
substrate is between 75 - 80% of the ball size?

Regards,
Wee Mei

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