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June 2003

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Subject:
From:
Lum Wee Mei <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 5 Jun 2003 15:36:04 +0800
Content-Type:
text/plain
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text/plain (19 lines)
Hello,

Just wonder anyone can provide the reason or how the pad on the BGA substrate
is between 75 - 80% of the ball size?

Regards,
Wee Mei

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