Dave,
Do you have a reference so we can read the paper/study please?
Regards
Eric Dawson
> -----Original Message-----
> From: Dave Chapman [SMTP:[log in to unmask]]
> Sent: Wednesday, June 04, 2003 3:39 PM
> To:   [log in to unmask]
> Subject:      Re: [TN] BGA problems on ENIG
> 
> Hi, just got e-mail from board supplier warning of tendency of BGA breaking
> off ENIG pads. Citing a study at University of NY at Binghamton from a few
> years ago. Claim growth of (Au0.5Ni0.5) at the Ni3Sn4/solder interface
> promoting brittle joints. Board house was using HASL and we prefer Immersion
> Silver but hadn't heard of the ENIG problem with BGA's
> Any comments?
> Dave Chapman
> Manufacturing Engineer
> Circuit Service Inc.
> 
> 

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