Hi, just got e-mail from board supplier warning of tendency of BGA breaking
off ENIG pads. Citing a study at University of NY at Binghamton from a few
years ago. Claim growth of (Au0.5Ni0.5) at the Ni3Sn4/solder interface
promoting brittle joints. Board house was using HASL and we prefer Immersion
Silver but hadn't heard of the ENIG problem with BGA's
Any comments?
Dave Chapman
Manufacturing Engineer
Circuit Service Inc.



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