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June 2003

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Subject:
From:
Rudy Sedlak <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 24 Jun 2003 18:35:10 EDT
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Phew...you certainly opened the door to some opinions....impressive.

And another one, with some general comments....

EN and IG are nightmare baths to control, and run, and getting good reliable
deposits is tough...can be done, but is quite difficult.  I suspect your
vendor wants to get away from them, and move to the much easier (and I suspect MUCH
cheaper) electrolytic methods....

However, remember, EN is one heckova lot more passive surface, and will
protect better, and conversely, if exposed, will be more difficult to solder to,
than electrolytic Nickel.  The two surfaces, EN and electrolytic Nickel are so
dissimilar that they almost cannot be compared.

Rudy Sedlak
RD Chemical Company

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