Good insight Werner,
We've discussed the same principle with Palladium finishes.
Personally, I'm an advocate for extended time at common process temperature
rather than increased temperature and the possible impact for products and
materials. This approach does impact throughput to a minor extent.
Mel Parrish
Director, Training Materials and Resources
Soldering Technology International
102 Tribble Drive
Madison, AL 35758
256 705 5530
256 705 5538 Fax
[log in to unmask]
www.solderingtech.com
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Werner
Engelmaier
Sent: Tuesday, June 17, 2003 10:49 PM
To: [log in to unmask]
Subject: Re: [TN] ENIG questions
Hi Poh,
Sure can. Ni disolves in Sn at a rate 40-times slower than Cu [see Klein
Wassink, Soldering in Electronics]; therefore you need much more thermal
energy to
form a good metallurgical bond. For more detail, you may also check my
reliability columns in Global SMT & Packaging magazine, particularly
"Soldering:
Quality & Reliability Issues," August 2001, and "Solder Joint Formation &
Intermetallic Compounds (IMCs)," April 2003.
Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com
In a message dated 06/17/2003 12:02:14, [log in to unmask] writes:
>Hi Werner,
>Can you explain the reason for raising the peak reflow temperature by 15
>to 20C when soldering to Ni ?
>Poh
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