Hi Poh,
Sure can. Ni disolves in Sn at a rate 40-times slower than Cu [see Klein
Wassink, Soldering in Electronics]; therefore you need much more thermal energy to
form a good metallurgical bond. For more detail, you may also check my
reliability columns in Global SMT & Packaging magazine, particularly "Soldering:
Quality & Reliability Issues," August 2001, and "Solder Joint Formation &
Intermetallic Compounds (IMCs)," April 2003.

Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com

In a message dated 06/17/2003 12:02:14, [log in to unmask] writes:
>Hi Werner,
>Can you explain the reason for raising the peak reflow temperature by 15
>to 20C when soldering to Ni ?
>Poh

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