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June 2003

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Subject:
From:
Reuven ROKAH <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 17 Jun 2003 07:25:58 +0300
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Good design of thermal pads is a key player in such PCBs.



ROKAH Reuven




                      Werner
                      Engelmaier               To:      [log in to unmask]
                      <[log in to unmask]         cc:
                      COM>                     Subject: Re: [TN] High heat sink board hand soldering
                      Sent by: TechNet
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                      16/06/03 07:19
                      PM
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                      E-Mail Forum.";
                      Please respond
                      to Engelmaier





Nee how Don,
1. I would preheat even higher, 110 to 115C, measured on the board.
2. I take it you talk surface pad, are your internal pads thermal-pad
designs?
3. If you have good Cu plating and no further soldering operations, and no
severe temperature cycling [in test or operation] 25 to 50% fill should be
o.k.

Regards,
Werner Engelmaier

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