TM-650 test 2.4.45 for determination of solder paste wetting and splatter
calls for a "liquid copper cleaner".  What would be a suitable, easily
available cleaner?  Would an off the shelf copper cleaner (Brasso comes to
mind) be suitable?  I would hesitate to use any mineral acids, weak or
strong, for fear of leaving behind a hyperactive surface that would oxidize
a little too greatly for this test.  Thanks to any and all who may respond.

George Carroll
Process Engineer, Siemens Energy & Automation
P.O. Box 1255
3000 Bill Garland Road
Johnson City, Tennessee 37605
(423) 461-2948
[log in to unmask]

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