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June 2003

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Subject:
From:
Lee Whiteman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 12 Jun 2003 09:50:49 -0400
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Ioan,

When we built Lead Free hardware for our internal and several external
trials, we used the same stencils as we would for SnPb and found not
problems with them. In fact, several of our technicians found Lead Free
solder paste to be easier to print than their SnPb counterparts.

While I doubt that the rheology of Lead Free and SnPb solder pastes are
identical, based on our experience, they are close enough to work
without changing the screen printing process parameters.

Hope this helps. Give me a call off-line for additional details.

Good Luck.

Lee Whiteman
Senior Manufacturing Engineer
ACI
E-Mail: [log in to unmask] <mailto:[log in to unmask]>
Ph: (610) 362-1200 x208
Fax: (610) 362-1290



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Tempea,
Ioan
Sent: Wednesday, June 11, 2003 7:40 PM
To: [log in to unmask]
Subject: [TN] Stencils for Pb-free


Hi Technos,

since there are not so many takers for Sasha's problems, I wonder if I
could tease you some more.

OK, there will be issues with material control, duplicate BOMs and AVLs,
removable solder pots, etc. But, what about the stencils? Will I be able
to use the stencils I use right now, or they are too contaminated with
Pb? Is the rheology of the PB-free paste identical to the one of the
SnPb? Should I keep the homeplating, or the full apertures will be OK?

Thanks,
Ioan

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