IPC-A-610C Section 6.5.2 Exposed Basis Metal
SMT ICs, OSP coated PWBs, leaded components, sides of land patterns,
conductors, and use of LPI solder resist, can have exposed basis metal
per original designs.

Note: PWA with alternative finishes (OSP) may exhibit solder wetting
only to specific areas where solder is intended. Exposed metal in
unsoldered areas should be considered normal under these circumstances,
provided the achieved wetting characteristics of the intended solder
connection areas are acceptable.

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of
> Franklin D Asbell
> Sent: Wednesday, June 11, 2003 8:52 AM
> To: [log in to unmask]
> Subject: Re: [TN] OSP Boards for IPC Class 3 product.
>
>
> Mike,
>
> I know a certain amount of exposed copper is allowable on
> bare boards, even for military product. For the bare board we
> reference IPC 6012. Is there an IPC performance standard for
> assembled product?

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