Hi, Dave,
Can you shed a little more light in this dark world and give us the story
of why you choose Immersion Silver over, say, Immsersion Tin for BGAs and
Fine-Pitch stuff. I'm interested from the Class 3 High Reliability
perspective and currently use ENIG for this type of assembly. For future
designs, though, I intend to move to either ImAg or ImSn, but haven't
determined which one yet.
TIA
Peter
Dave Chapman <[log in to unmask]> 10/06/2003 06:53 PM
Sent by: TechNet <[log in to unmask]>
Please respond to "TechNet E-Mail Forum."; Please respond to Dave Chapman
To: [log in to unmask]
cc: (bcc: DUNCAN Peter/Asst Prin Engr/ST Aero/ST Group)
Subject: Re: [TN] LCC HASL and Immersion Silver
We use Immersion Silver for all assemblies which have a BGA or less than 25
mil pitch components.
Dave Chapman
Manufacturing Engineer
Circuit Service Inc.
-----Original Message-----
From: Carlr Ray [mailto:[log in to unmask]]
Sent: Monday, June 09, 2003 5:32 PM
To: [log in to unmask]
Subject: [TN] LCC HASL and Immersion Silver
Hello All,
Got a question for you guys....
I have a customer who has a product in design review. We provided
feedback with the following concerns. My question is what would you guys
recommend for an alternative surface finish if the customer does not
change parts?
1. PCB has 3 FPBGAs, 1.0 mm pitch (64 ball count) 12mm x 14mm package
2. PCB has 1 LCC, .5mm pitch (28 pins) 10mm x 10mm package
3. PCB has 4 QFPs, <.5mm pitch (28 - 204 pin count)
4. PCB has HASL finish
We have recommended changing the LCC to a BGA or QFP device and
changing the finish to Immersion Silver.
Carl Ray
Sr. Manufacturing Engineer
Huntsville, AL 35807
Phone: 256-882-4800 ext. 8845
Cell: 256-990-1990
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