For hi-tech companies, excelling in a specific application is the only
way to survive today.  

Here's your once in a lifetime opportunity to absorb all the information
you need about the new, high speed packaging systems, those operating at
2GHZ and above.  Don't miss this one day " IC Packaging and
Interconnections" seminar, sponsored by IPC and BPA Consulting Ltd on
July 1, 2003 in San Jose, Cal.  

Find out about the markets, the requirements, the materials and the
technical characteristics necessary to succeed.  

Limited seating. Register today before the seminar sells out!  

http://ipcmail.ipc.org/bpa_email/bpa_email.html

Questions? Send email to [log in to unmask]

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