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June 2003

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Subject:
From:
"Anderson, Greg (IndSys, GEFanuc, NA)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 10 Jun 2003 08:05:03 -0400
Content-Type:
text/plain
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text/plain (64 lines)
Carl,

I would vote strongly for both of your recommendations.

Greg Anderson
Senior Advanced Manufacturing Engineer
GE Fanuc Automation
Charlottesville, VA


-----Original Message-----
From: Carlr Ray [mailto:[log in to unmask]]
Sent: Monday, June 09, 2003 6:32 PM
To: [log in to unmask]
Subject: [TN] LCC HASL and Immersion Silver


Hello All,
 Got a question for you guys....

I have a customer who has a product in design review. We provided
feedback with the following concerns. My question is what would you guys
recommend for an alternative surface finish if the customer does not
change parts?

1. PCB has 3 FPBGAs, 1.0 mm pitch (64 ball count) 12mm x 14mm package
2. PCB has 1 LCC, .5mm pitch (28 pins) 10mm x 10mm package
3. PCB has 4 QFPs, <.5mm pitch (28 - 204 pin count)
4. PCB has HASL finish

We have recommended changing the LCC to a BGA or QFP device and
changing the finish to Immersion Silver.

Carl Ray
Sr. Manufacturing Engineer
Huntsville, AL 35807
Phone: 256-882-4800 ext. 8845
Cell: 256-990-1990

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