Hi Günter,
The issue is not the thermal mass of the solder pot relative to thhe PCB (the 
assumption, that the solder wave runs at a constant temperature iis a good 
one), the issue is a heat transfer problem. Given the temperature of the solder 
and given the contact time, is there sufficient heat transferred to raise the 
temperature of the surfaces to be soldered sufficiently. It simply takes 
longer for more massive compenents than for smaller ones.
Will you be in Brussels for the Lead-Free Conference?

Regards,
Werner Engelmaier

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