In addition, a few other factors:
Routing, potential shorting between balls (preferred smaller pads), shear
strength (larger, the better), impedance matching, etc.
Rgds
Tonglong Zhang
Staff Engineer
IC Packaging Engineering
Broadcom Corporation
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Misner, Bruce
Sent: Thursday, June 05, 2003 7:39 AM
To: [log in to unmask]
Subject: Re: [TN] BGA substrate pad
The reason is to prevent ball collapse which maintains BGA standoff height
for improved thermal cycling reliability.
Regards,
Bruce Misner
-----Original Message-----
From: Lum Wee Mei [mailto:[log in to unmask]]
Sent: Thursday, June 05, 2003 3:36 AM
To: [log in to unmask]
Subject: [TN] BGA substrate pad
Hello,
Just wonder anyone can provide the reason or how the pad on the BGA
substrate is between 75 - 80% of the ball size?
Regards,
Wee Mei
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