Dear Mike:

Some of the confusion with exposed copper on land areas is derived from
IPC-A-610C at paragraph 6.5.6 Nonwetting. Figure 6.51 shows such a board
with a likely OSP coating board with soldered a "J" lead SMT component.
This is one of the sections I point out that the text take precedence
over the figure (and in this case rightly so).

As for actual experience with OSP PCB's I will leave that to the other
experts.

Gregg A. Owens
Executive Director
Manufacturing Technology Training Center, Inc.


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of No Name
Sent: Wednesday, June 11, 2003 4:29 AM
To: [log in to unmask]
Subject: [TN] OSP Boards for IPC Class 3 product.

Does anyone out there have experience with OSP and IPC class 3 products?
We have considered changing over to OSP as things shift to lead free. We
also see a cost savings in converting. However, some of our quality
people
do not believe the exposed copper on the edges of the pads is
acceptable. I
see nothing in the J-STD-001 or IPC-610 that says the fillet must cover
the
entire pad. Can anyone relate their experience selling OSP assemblies to
the
military?

Thanks for your replies.
-Mike McGee

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