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Thu, 12 Jun 2003 08:20:13 +0800 |
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Hi, Mike,
I have no experience selling OSP assemblies to the Military, because we
rejected OSP as a finish for such Class 3 boards. Rejection was on the
grounds that it didn't survive double reflow well.
I don't think exposed copper is quite the issue it once was for some
reason, especially if the boards are conformally coated. I think sharp
points like cropped connector pins are still supposed to be over-soldered
so that they don't puncture a coating, but otherwise exposed copper is OK.
Check out IPC-A-610 for acceptability.
Peter
No Name <[log in to unmask]> 11/06/2003 07:29 PM
Sent by: TechNet <[log in to unmask]>
Please respond to "TechNet E-Mail Forum."; Please respond to mike.mcgee
To: [log in to unmask]
cc: (bcc: DUNCAN Peter/Asst Prin Engr/ST Aero/ST Group)
Subject: [TN] OSP Boards for IPC Class 3 product.
Does anyone out there have experience with OSP and IPC class 3 products?
We have considered changing over to OSP as things shift to lead free. We
also see a cost savings in converting. However, some of our quality people
do not believe the exposed copper on the edges of the pads is acceptable. I
see nothing in the J-STD-001 or IPC-610 that says the fillet must cover the
entire pad. Can anyone relate their experience selling OSP assemblies to
the
military?
Thanks for your replies.
-Mike McGee
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