For hi-tech companies, excelling in a specific application is the only
way to survive today.  

Here's your once in a lifetime opportunity to absorb all the information
you need about the new, high speed packaging systems, those operating at
2GHZ and above.  Don't miss this one day " IC Packaging and
Interconnections" seminar, sponsored by IPC and BPA Consulting Ltd on
July 1, 2003 in San Jose, Cal.  

Find out about the markets, the requirements, the materials and the
technical characteristics necessary to succeed.  

Limited seating. Register today before the seminar sells out!  

http://ipcmail.ipc.org/bpa_email/bpa_email.html

Questions? Send email to [log in to unmask]

---------------------------------------------------------------------------------
DesignerCouncil Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF DesignerCouncil.
To set a vacation stop for delivery of DesignerCouncil send: SET DesignerCouncil NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------