Hi, Chris,

Not sure how you've arrived at your information that ENIG boards require
higher temperatures than HASL boards - after all, it's the solder you're
melting, not the plated finish. The profile used by our CEM takes board
temp up to 208 C for both HASL and ENIG.

Peter



Chris Murphy <[log in to unmask]>    13/05/2003 07:32 AM
Sent by: TechNet <[log in to unmask]>

Please respond to "TechNet E-Mail Forum."; Please respond to Chris Murphy

              To:  [log in to unmask]
              cc:  (bcc: DUNCAN Peter/Asst Prin Engr/ST Aero/ST Group)
              Subject: [TN] ENIG reflow profile vs HASL








Hi Technetters,

looking through the Technet archives on the differences between HASL and
ENIG
boards, I notice that higher temeperatures are required for soldering ENIG
boards.

Presumably this is because the gold layer firstly has to be dissolved, and
we are
dealing with a Ni/Sn intermetallic rather than a Cu/Sn intermetallic.

Does anyone have any recommendations on what differences have to be made to
the
reflow profile (e.g. different times above 183 deg C or 200 deg C)?  Or can
the same
profile be used for the same board regardless of whether it is HASL or
ENIG?

Thanks in advance for any replies.

Regards,

Chris Murphy,
Production Engineering,
Tait Electronics

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