Hi Technetters,

looking through the Technet archives on the differences between HASL and ENIG
boards, I notice that higher temeperatures are required for soldering ENIG boards.

Presumably this is because the gold layer firstly has to be dissolved, and we are
dealing with a Ni/Sn intermetallic rather than a Cu/Sn intermetallic.

Does anyone have any recommendations on what differences have to be made to the
reflow profile (e.g. different times above 183 deg C or 200 deg C)?  Or can the same
profile be used for the same board regardless of whether it is HASL or ENIG?

Thanks in advance for any replies.

Regards,

Chris Murphy,
Production Engineering,
Tait Electronics

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