Dear Mr. Muralidhara,
There are many advantages. some of them are:
a) Good current distribution for electrolytic plating & min.
variation of plated thickness.
b) Reducing plated copper usage by minimising copper area.
c) Being a ground plane, current carrying capacity is not a concern,
but should give good grounding and shielding effects, if any.
d) In multi-layers, where ground layers are in inner layers, gives
better prepreg adhesion and bonding.
e) Minimises warpage, because of better copper distribution
across layers.
Regards
M A Ranganath
GM - Technical & Quality
Sanmar Micropack Limited
Plot No.16, Jigani Industrial Area,
Bangalore - 562 106. INDIA
Phone: 91 - 80 - 7825223/224/226/389
Fax : 91 - 80 - 7825225
Email : [log in to unmask]
Murulidhara S
<rpcblab_bgp@ITI To: [log in to unmask]
LTD.CO.IN> cc:
Sent by: TechNet Subject: [TN] Cross-Hatching for Ground
<[log in to unmask] Portion of PCBs
>
10-05-03 01:15
PM
Please respond
to "TechNet
E-Mail Forum.";
Please respond
to Murulidhara S
Sirs,
Sub : Cross-Hatching for Ground Portion of PCBs
I would like to know the reason for providing cross- hatch patterns in the
ground portion of the PCBs instead of being fully covered by copper.
Is there any specific advantage apart from providing good adhesion for the
solder-mask?
Does it help in prevention of warpage of PCBs?
What is the effect on the electrical resistance? Is any documented info
available on this aspect?
Regards.
Mr.Murulidhara S.
Deputy Chief Engineer ,
PCB and Chemical Lab - R&D,
ITI Ltd. ,
Dooravani Nagar ,
Bangalore
INDIA
PIN-560 016
Ph : 91-080-8503959
Fax : 91-080-5650971
---------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315
-----------------------------------------------------
* * * * * * * * * * * * * * * * * * * * * * * * * * * * * *
The information contained in this message is legally privileged and
confidential information intended only for the use of the addressed
individual or entity indicated in this message (or responsible for
delivery of the message to such person). It must not be read, copied,
disclosed, distributed or used by any person other than the addressee.
Unauthorised use, disclosure or copying is strictly prohibited and may be
unlawful.
Opinions, conclusions and other information on this message that do not
relate to the official business of any of the constituent companies of
the SANMAR GROUP shall be understood as neither given nor endorsed by
the Group.
If you have received this message in error, you should destroy this
message and kindly notify the sender by e-mail.
Thank you.
* * * * * * * * * * * * * * * * * * * * * * * * * * * * * *
---------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------
|
