Good afternoon all,

The subject of solder fountains has come up on the Pin Grid thread and has reminded me to
ask for your parameters for this process.  Pot temperature would be one parameter of
interest. Is preheating necessary for all assemblies of for just the thermally challenged
assembly.  I have determined the flow rate is important to getting heat into the board,
but I'm thinking something resembling Kilauea might be extreme.  Any guidance on what good
flow off the nozzle should look like?

Thanks and have a good weekend,

Gary Camac

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