Yannick:
                For your situation it is better to practice on some dummy
boards and parts. You can purchase both from more than one place, search the
internet.  Before the board is place over the solder fountain or any other
device, bake the board at about 220 F for an hour. Take one  board at a time
from the oven directly to the desoldering system. Prior to baking, mask
areas around the component with liquid solder masking or tape. The new part
can be resolder by hand or use a selective solder wave fixture.
                Regards,
                Ramon


> With that costly a component I would remove pin grid arrays with a
> selective
> solder machine or 'solder fountain' and a custom nozzle or flow well.  SMT
> components within the PGA footprint can be carefully masked or removed and
> replaced.  Pin-in-paste may be the most effective manufacturing process
> for
> this assembly, but unless there is something in the design I do not
> understand, paste should not be required for rework.  Rework the PGA using
> standard through hole rework processes and do not expose the entire
> assembly
> to another reflow cycle.
>
> Best of Luck,
> Brad Vanderhoof
> AITI
>
> ----- Original Message -----
> From: "Yannick Brisson" <[log in to unmask]>
> To: <[log in to unmask]>
> Sent: Thursday, May 08, 2003 9:38 AM
> Subject: [TN] Pin Grid Array
>
>
> > Hi,
> >
> >   I would like to have some hint about Pin Grid array.  One customer
> have
> 4
> > PGA 599  on his board, the chip cost around 1000$...i'm wondering if
> there
> > is someone is who have already worked with this type of component and
> done
> > some rework.  I guest is they don't have any rework to do it would be
> like
> > juste other IC but what do you use to rework them? take it off and put
> in
> > back in?  when you rework it how do you solder them? how do you
> applicate
> > paste on each pin??
> >
> > Thanks You
> >
> > Yannick
> >
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