Bev, I don't have comments/recommendations on record for this unique
situation for either J001D or 610D working drafts.

Jack

Jack Crawford
Director, Certification and Assembly Technology
[log in to unmask]
847-790-5393
fax 847-504-2393
 

-----Original Message-----
From: Bev Christian [mailto:[log in to unmask]] 
Sent: Friday, May 30, 2003 4:07 PM
To: [log in to unmask]
Subject: Re: [TN] PTH Hole Fill


Rich,
Yes I am aware of that part. I should have said so in my e-mail. Someone
is suggesting for the condition stated that it is relaxed even further!
I am not aware of any such provision. 
Bev
--------------------------
Sent from my BlackBerry Wireless Handheld (www.BlackBerry.net)


-----Original Message-----
From: Rich Lasko <[log in to unmask]>
To: 'TechNet E-Mail Forum.' <[log in to unmask]>; Bev Christian
<[log in to unmask]>
Sent: Fri May 30 17:08:27 2003
Subject: RE: [TN] PTH Hole Fill

Bev,

I don't recall seeing any statements verbatim to what you've described
below
but see section 6.3.1 (Fig. 6-6) of A610 Rev. C and section 9.2.5.1 of
J-STD-001C.  These sections do talk about allowable solder depression
(up
to a maximum of 25%).  But I would also recommend finding out what type
of
environment the assembly will end up in.  High vibratory and/or thermal
shock environments may need further review before stating that such
solder
depression is okay.  Hope this helps.

Rich Lasko
Badger Electronics

-----Original Message-----
From: Bev Christian [mailto:[log in to unmask]] 
Sent: Friday, May 30, 2003 3:49 PM
To: [log in to unmask]
Subject: [TN] PTH Hole Fill

Technetters,
Someone in our company is quite sure "there was a relaxation of solder
fill
when and if the lead of the component was not sufficiently large enough
compared to the PTH to which it was soldered".  I have no recollection
of
such a change in A610. But the maybe some of my brain cells are on
vacation.
Can anyone comment on the statement about hole fill, please?  Thanks.

Bev Christian
Research in Motion

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