Check radiation hardening device on the web.  The fine pitch device is
more sensitive to radiation damage (one single cascade zone will damage
few device... If the high energy beam is used).  By the way, why you
need to zap with X-ray?  Poor process development work? Lousy design?
Development should be done using dummy or others... I do not see a need
to zap production parts with high energy X-ray.... Must be something
new...

jk

>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of
>[log in to unmask]
>Sent: Thursday, May 29, 2003 9:09 PM
>To: [log in to unmask]
>Subject: Re: [TN] X-ray beam damaging flash memories
>
>
>Hi, Eric,
>
>I haven't experiences it, but I've certainly heard about it
>from the company that makes the X-Ray machinery we use. They
>did say that (with their equipment) exposure would have to be
>quite prolonged to cause the problem though. They did at least
>warn us when we asked the question about X-Ray hardening or
>other damage.
>
>Peter
>
>
>
>Eric Castonguay <[log in to unmask]>     29/05/2003 08:03 PM
>Sent by: TechNet <[log in to unmask]>
>
>Please respond to "TechNet E-Mail Forum."; Please respond to
>Eric Castonguay
>
>              To:  [log in to unmask]
>              cc:  (bcc: DUNCAN Peter/Asst Prin Engr/ST Aero/ST Group)
>              Subject: [TN] X-ray beam damaging flash memories
>
>
>
>
>
>
>
>
>Hi guys,
>Never heard about this one in 4 years in the telecom industry.
>Our current supplier of flash memories found a very
>interesting reason why we are having problems with their
>parts. The strength of X-ray being used by the CM on our cards
>for 5-dx analysis is too strong, they said. Industry standard
>is 1K rad max I was told. Going above it causes issues with
>the analog section of the programming in the die.
>
>There were able to tweak the registers & re-test them and had
>no problems with the chips.  They also tried re-exposing them
>and suceeded in repeating the problem. I asked if we could do
>anything to fix boards that have already been x-rayed and they
>said that this cannot be done once the parts are assembled on
>the boards.
>
>Considering that Flash is not the only component with an
>analog section in it, I think that it would be a good idea to
>investigate the x-ray equipment, strength & techniques at our
>CM, even if they use a standard Agilent 5DX machine. But first
>I want to hear if some of you ever met this problem before.
>
>Thanks.
>Eric
>
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