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Subject:	Solder through conformal coating
From:	Augustin Stan <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Fri, 30 May 2003 02:14:38 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (24 lines)

Hi All who have responded to this issue and thank you,

The configuration of pads is for a SIM CARD, the assembly is a Class 2
product, with three pads on opposite sides, L and W  3.3X1.3 mmxmm (130
milsx50mils), pitch is 2.54 mm (100mils). The connections are not the
subject to high currents or voltages, CMOS circuits; the principal function
is for mechanical sustaining. The coating is 1R32A from HumiSeal and the
thickness is about 30 to 50 micro (~ 1mil to 2 mils). After hand soldering
I remove the residues with a hard brush and I repair the coating with a
fresh one by brushing.

Gusti

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