If you have enough gold it can make a brittle compound with tin when using
tin/lead solders. The component being plated with tin doesn't alter this.
200micro inches (5um) is about 5 x the amount needed to give you
embrittlement. The solution is to avoid either the gold finish or use a
solar without tin.

This is a common enough problem that we have an applications note on it. You
can get this in a couple of clicks [without even having to register] from
our website. If you prefer I can send it you direct.

Regards

Mike Fenner

Applications Engineer, European Operations
Indium Corporation
T: + 44 1908 580 400
M: + 44 7810 526 317
F: + 44 1908 580 411
E: [log in to unmask]
W: www.indium.com
Pb-free: www.Pb-Free.com



-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of James
TerVeen
Sent: Thursday, May 29, 2003 2:41 PM
To: [log in to unmask]
Subject: [TN] tin, gold


I have a customer whom is using a component (surface mounted cap) that we
provide that has tin plated terminations.     They are using it on a
substrate that is gold plated with what they say is 200 micro inches of
plating.   I have heard of gold embrittlement with solder.  does this hold
true with tin as well.

Thanks in advance

Jim

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