Hi Ofer,
it seems that you start seeing the lead free craze. It's coming and it will
hit us all big time. So you better prepare for this, a good start is
http://www.leadfree.org/.
Now, as for the new IC finishes only, you should not have concerns with
higher temps, they are supposed to solder with the regular SnPb37 recipes.
The difference will come when you will start using the lead-free paste and
solder bars. This needs higher temperatures.
Now, these are the rough lines, I will not tell you about the tin whiskers,
in case the component leads are pure tin plated. I will not tell you either
about the Pd plating, that might push you to bump up the temperatures.
Regards,
Ioan
> -----Original Message-----
> From: Ofer Cohen [SMTP:[log in to unmask]]
> Sent: Thursday, May 29, 2003 11:06 AM
> To: [log in to unmask]
> Subject: [TN] Combination Leadless and SnPb
>
> Hi all,
> Lately I receive messages from components manufacturers, stating they are
> moving from Tin-Lead finish to lead-less finish (not specified which one -
> my regular question that regularly is not being answered). Most of the
> components are still with the SnPb finish, the PCBs Tg are 145 deg C,
> unless
> I had a specific need (extra depth, for instance to move to what is
> currently called high Tg (and in the future will probably be the standard
> boards) and the pastes are, of course, SnPb, hence would not survive the
> higher soldering temperature needed to tickle the lead-less finish.
>
> Should I modify the work processes? Should I wait? Are there any
> workmanship/ reliability effects to these changes? Helppppppppppp...
>
> Regards
> Ofer Cohen
> Quality Assurance Manager
> Seabridge Ltd.
>
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