Hi all,
Lately I receive messages from components manufacturers, stating they are
moving from Tin-Lead finish to lead-less finish (not specified which one -
my regular question that regularly is not being answered). Most of the
components are still with the SnPb finish, the PCBs Tg are 145 deg C, unless
I had a specific need (extra depth, for instance to move to what is
currently called high Tg (and in the future will probably be the standard
boards) and the pastes are, of course, SnPb, hence would not survive the
higher soldering temperature needed to tickle the lead-less finish.

Should I modify the work processes? Should I wait? Are there any
workmanship/ reliability effects to these changes? Helppppppppppp...

Regards
Ofer Cohen
Quality Assurance Manager
Seabridge Ltd.

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