Dear Madam / Sir,

We do not consider this to be an advertisement - but if you do, please
delete before going further.  This is a news about an alternative process
and if you desire to know more about it regarding Copper, Electroless
simplified process, Peel strength, Thermal dissipation, simplified SBU, even
new Direct Structuring capabilities, with new Polyimide (not on the market
as of today, but samples available) or regular epoxy resins, even Solder
Mask with simplified electroless capabilities and Thermal dissipation..
there is an alternative called "Cu2O Deposition Process" - a presentation is
available on the below website.

Very Best Regards - Roland

www.PCBspecialist.com
Roland Jaquet - PCBspecialist - 14 ch. de Vers - CH-1228 Plan-Les-Ouates -
Geneva - Switzerland - T +41-22-880-0405 - F +41-22-880-0409 - GSM
+41-79-203-3723 - Company & Technical Viability - Yield Improvement -
Company Strategy & Acquisition - Equipment &  Technology Choice - EIPC
Member


----- Message d'origine -----
De : Larry Russell
A : [log in to unmask]
Envoye : jeudi, 29. mai 2003 05:28
Objet : [TN] FW: formula lead to peeling strength of pad on finished PCB


> Dear sir/lady:
>
> Is there any formula available for peeling strength calculation of any
kinds of pads on finished PCB?
> there is formula for that of  laminate materials or land stated in IPC
TM-650, but not for pads on finished board,
At your convenience,  we would like to have your offered information.
Thanks!    Have a nice day!


> Best Regards
>
>
> Jack  Low
>
> E-MAIL: [log in to unmask]
>

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