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Subject:	FW: formula lead to peeling strength of pad on finished PCB
From:	Larry Russell <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Thu, 29 May 2003 11:28:47 +0800
Content-Type:	text/plain
Parts/Attachments:	text/plain (26 lines)

> Dear sir/lady:
> 
> Is there any formula available for peeling strength calculation of any kinds of pads on finished PCB?
> there is formula for that of  laminate materials or land stated in IPC TM-650, but not for pads on finished board,
At your convenience,  we would like to have your offered information.  Thanks!    Have a nice day!


> Best Regards
> 
> 
> Jack  Low
> 
> E-MAIL: [log in to unmask]
>   

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