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May 2003

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Mon, 26 May 2003 12:44:06 +0800
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Hi, Ioan,

What sort of volume are you talking about? If it's in the thousands, I
would make the discretes SMT and the connectors TH, then try to wave solder
the whole lot. If you can't wave solder, CR the discretes and the
connectors + fuse holder, using solder preforms for the TH parts.

If the volume is low, TH parts and manual insertion may be as quick/cheap
as CR with all the programming, etc.

One other consideration is power consumption and space constraints, if you
have any. TH parts may impact on both.

Peter


"Tempea, Ioan" <[log in to unmask]>   24/05/2003 12:33 AM
Sent by: TechNet <[log in to unmask]>

Please respond to "TechNet E-Mail Forum."; Please respond to "Tempea, Ioan"

              To:  [log in to unmask]
              cc:  (bcc: DUNCAN Peter/Asst Prin Engr/ST Aero/ST Group)
              Subject: [TN] Through-hole design vs.  SMT design








Hi Technos,

I have a dilemma on my hands. An assembly that has about 15 passives (caps
and resistors), a connector and a fuse holder. The connector must be TH and
probably so does the fuse holder. The designers came with the question:
"for
lower manufacturing costs should we design the board 100% TH, or make the
passives SMT and keep the other 2 parts TH". Interesting...

And here come my questions:

*       what are the technical criteria that you use when trying to solve
this kind of riddle?
*       what are the economical criteria?
*       what parameters could I use for a breakeven analysis?

Thank you,
Ioan

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