Hi, Ioan,
What sort of volume are you talking about? If it's in the thousands, I
would make the discretes SMT and the connectors TH, then try to wave solder
the whole lot. If you can't wave solder, CR the discretes and the
connectors + fuse holder, using solder preforms for the TH parts.
If the volume is low, TH parts and manual insertion may be as quick/cheap
as CR with all the programming, etc.
One other consideration is power consumption and space constraints, if you
have any. TH parts may impact on both.
Peter
"Tempea, Ioan" <[log in to unmask]> 24/05/2003 12:33 AM
Sent by: TechNet <[log in to unmask]>
Please respond to "TechNet E-Mail Forum."; Please respond to "Tempea, Ioan"
To: [log in to unmask]
cc: (bcc: DUNCAN Peter/Asst Prin Engr/ST Aero/ST Group)
Subject: [TN] Through-hole design vs. SMT design
Hi Technos,
I have a dilemma on my hands. An assembly that has about 15 passives (caps
and resistors), a connector and a fuse holder. The connector must be TH and
probably so does the fuse holder. The designers came with the question:
"for
lower manufacturing costs should we design the board 100% TH, or make the
passives SMT and keep the other 2 parts TH". Interesting...
And here come my questions:
* what are the technical criteria that you use when trying to solve
this kind of riddle?
* what are the economical criteria?
* what parameters could I use for a breakeven analysis?
Thank you,
Ioan
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