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May 2003

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Subject:
From:
"Gray, Matthew D HS-SNS" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 22 May 2003 09:54:18 -0400
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Hello -

I am requesting feedback to material and processes that have provided
environmental performance protection for BGAs and other large array
packages.  The performance environment of consideration is corrosion and
humidity.

Can users provide particular details regarding application process spray
(inclusion of steps used for flood/fill/etc), dip, other, and material that
has provided a high amount of coverage and ability to protect electrical
connections and components in humidity and salt fog environments.  Ideally,
these materials are below the parylene step.  All feedback is appreciated.

Regards - Matt

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