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May 2003

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Subject:
X-Ray Inspection of BGAs
From:
"Anderson, Greg (IndSys, GEFanuc, NA)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 21 May 2003 16:58:55 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (44 lines) 
Technetters,

We are currently evaluating off-line X-Ray inspection machines for the
process development and periodic process monitoring of BGA, u-BGA, etc
Printed Wiring Assemblies.  For those of you who have such machines:

1) How important is a feature that allows actual measurement of the ball
diameter vs. "uniformity" of the balls?  The candidate systems accuracy
claims vary from +/- 0.001" down to +/-0.00025".  Is it possible or
desirable to measure and log the diameters? (intuitively, I believe so, but
maybe the "noise" of part to part, or PWA warpage makes this irrelevant).

2)  How important is the ability to view at oblique angles greater than 45
degrees?  Do you need to go to 75 degrees?

3)  How much magnification is "enough"?  600X ?  1200X?

4)  Are you able to develop and use "Printed Wiring Assembly Specific"
programs?  That is, can you build an inspection routine to look at one or
more locations on the assembly, store it, then call it later when that
product comes around again?  How difficult is it to program?  Can it be done
by someone other than an engineer?

Please, if you are going to mention specific systems, respond off line (and
off the record, if need be), to avoid flaming repercussions.  I need frank
responses.

Thanks,
Greg Anderson
Senior Mfg Engineer
GE Fanuc Automation
phone:  434-978-5181

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