Hi Ofer,
That could be true for PCBs subjected to HASL; for non-HASL'ed PCBs there is
no loading condition that should produce barrel cracks or inner-layer
separation. I would be interested to hear, if your experience is contrary to this.

Regards,
Werner Engelmaier

In a message dated 05/20/2003 9:42:00, [log in to unmask]
writes:
>Since the PCB manufacturers (at least, those we are purchasing from...) are
>inspecting the discrete layers with AOI, and (seldom) also checking them
>electrically, then the major reason for failures during the final electrical
>testing is via opens. This rate is a function of the aspect ratio, and
>heavily depends on the manufacturer's process capability. The failure rate
>may well pass the 20% in complex card.

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