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May 2003

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Subject:
Re: Inner layer separation
From:
Scott Westheimer <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 19 May 2003 15:21:37 -0400
Content-Type:
text/plain
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text/plain (52 lines) 
Inner layer separation between the electroless copper plating and the inner
layer copper foil is normally always due to under micro etch, over
conditioning or accelerating, re-oxidation of the copper surface or
contamination.

Hope this helps.

Scott B. Westheimer
Gul Technologies PTE
5709 Clarks Fork Drive
Raleigh, North Carolina 27616
Phone: (919)713-4358
Fax: (919)713-4358
Cell: (919)649-1510
Email: [log in to unmask]
http:///www.gultech.com
----- Original Message -----
From: "No Name" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, May 19, 2003 2:05 PM
Subject: [TN] Inner layer separation


> Inner layer separation ....
> What are the major board fab causes?
> What are the major board assembly causes?
>
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