Some copper will be removed during solder stripping...it is inevitable...the
trick is controlling the amount of copper removed (time...time...time) and
evaluating a sample afterwards... Too much copper removed and you'll see
problems in assembly...blowholes, voids, etc.. Also, as this will subject
the boards to additional wet processes...bake them... You might even request
a microsection be performed to check hole wall quality after the
stripping...
Franklin
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