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May 2003

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Subject:
From:
Lum Wee Mei <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 16 May 2003 15:21:04 +0800
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Guenter,

Thank you so much for the prompt reply.

Regards,
Wee Mei

Guenter Grossmann wrote:

> Wee Mei
>
> The question of design rules came up by the fact that the wetting
> behaviour of led free solder in the possible process window is somewhat
> different from the one of SnPb. However, our trials in LEADFREE and some
> pilot production in the companies associated in the project with
> standard design rules showed no problems in the soldering process due to
> the design. It can be, in wave soldering, if space is very restricted
> and thus no solder thieves can be used when soldering fine pitch
> components and components are set close together, you see more bridges .
> But it has to be emphasised that, if the IPC design rules are
> consequently applied, lead free soldering is not a big deal.
>
> Best regards
>
> Guenter
>
> EMPA
> Swiss Federal Institute for Materials Testing and Research
> Centre for Reliability
> Guenter Grossmann,  Senior Engineer
>
> 8600 Duebendorf
> Switzerland
>
> Phone: xx41 1 823 4279
> Fax :     xx41 1823 4054
> mail:     [log in to unmask]
>
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