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Subject:	Impact of Pad Geometry on Lead-Free Application
From:	Lum Wee Mei <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Fri, 16 May 2003 13:29:16 +0800
Content-Type:	text/plain
Parts/Attachments:	text/plain (43 lines)

Dear Techies,

I understand the topic of Pb-free is very hot especially with the
annoucement if its ban within the European markets with effect from
2006. Having much talks about Pb-free and its many concerns and
uncertainties, I would like to add one question :

IPC-SM-782 has been around for many years and if I may put it would be
in conjunction with the current SnPb process so the pad goemtory so used
at design will not cause any reliability from fabrication to assembly.
Will implementation of Pb-free process require changes to be made to the
current pad geometry? Someone asked me this question because some
sources say so.

1. A Practical Guide to Achieving LEad-Free Electronics Assembly by Karl
Seeling and Davide Suraski of AIM
    - mentioned in this paper that established PCB designs rules may
need to change during the tranisition to lead-free soldering to ensure
amnufacturability and reliability.

2. IPC Roadmap : A Guide for Assembly of Lead-Free Electronics 4th draft
date Jun 2000
    - mentioned a list of standards that will be affected and one of
them is the design standards from IPC-2221 - 2225. Although IPC-SM-782
is not mentioned, IPC-2221 - 2225 uses it.

I would appreciate some of you can give me some lights to brighten my
dark path :8)

Thanks and regards,
Wee Mei

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