Becerra,

I am not familiar with this package but I did scan through the information that you attached.  Since this is a leadless device you need to be concerned with reliability.  I do not know the life expectancy of the products you are building, the environment they will be operated in or the type of substrate you are placing them on so you need to be careful.  The area to watch is the CTE mis-match between the device and the substrate.  Another factor is the type of solder you are using i.e. leadfree or Eutectic.  The bigger the mismatch the lower the life of the product will be.  If reliability is a concern, you will probably want to model the attachment reliability or ask Amkor if they have some data you can look at.  I did not see anything in the data sheet.  Leadless devices typically have much lower attachment reliability.


Russell Nowland
Lucent Technologies, Suite 100
7725 West Reno Ave.
Oklahoma City, OK 73127
Phone: 405-782-7765
Fax: 405-782-7905
email: [log in to unmask]


-----Original Message-----
From: Becerra Alejandro [mailto:[log in to unmask]]
Sent: Wednesday, May 14, 2003 12:12 PM
To: [log in to unmask]
Subject: [TN] MLF Component


Hello,

Have somebody used MLF components?
Product management is requesting to change some components to this type of
package.
The component has a 0.5 mm pitch.
I found some information in the attached link, it is recommending to use a
0.125mm (5 mil) stencil to print solder paste for this component.

http://www.amkor.com/products/notes_papers/MLF_AppNote_0902.pdf

Is it necessary to use this type of stencil with this component?

Regards,

Alejandro Becerra

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