Hello,

Have somebody used MLF components?
Product management is requesting to change some components to this type of
package.
The component has a 0.5 mm pitch.
I found some information in the attached link, it is recommending to use a
0.125mm (5 mil) stencil to print solder paste for this component.

http://www.amkor.com/products/notes_papers/MLF_AppNote_0902.pdf

Is it necessary to use this type of stencil with this component?

Regards,

Alejandro Becerra

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