Hi Jefrrey,
I am wandering why people so easy change the industrial standarts.Take as
example Nickel-Gold thickness on the fingers. IPC for years states Au
thickness of 0.8 to 1.3 microns over 2.5 microns of Nickel.
Based on this, PCB manufacturers are building the their equipment for Ni-Au
plating of the fingers such as "tab plating machines" . Your "tendency to
specify" 2.5 micron of gold makes most of standart finger plating
processes not possible to perform .
Regards
Edward
Edward Szpruch
Eltek Ltd
P.O.Box 159 ; 49101 Petah Tikva Israel
Tel ++972 3 9395050 , Fax ++972 3 9309581
e-mail [log in to unmask]
> -----Original Message-----
> From: McGlaughlin, Jeffrey A [SMTP:[log in to unmask]]
> Sent: ג מאי 13 2003 20:46
> To: [log in to unmask]
> Subject: Re: [TN] Printed Wire Board / Printed Circuit Board and
> Options C ards - G old Finger Thickness Round Robin Test
>
> Victor -
>
> IPC-2221 addresses gold edge card plating thickness in paragraph 4.4.4 and
> table 4-3. For class 2 (most commercial boards) the plating requirement
> is 0.8um (minimum) Au over 2.5um Ni, for Class 3 it is 1.3um (minimum) Au
> over 2.5um Ni. When I do gold fingers I tend to specify 2.5-5.0um Nickel/
> 2.0-3.0um Au. So if the nickel underneath meets spec your boards should be
> fine.
>
> Soft Gold is purest (24k) with no iron, cobalt, or nickel co deposited,
> generally used for wire bonding. Hard gold is 23+k but uses co-deposits to
> prevent ware on switch pads or card edge connector fingers. Flash or
> Immersion gold is plated chemically, is supposed to self limit the plated
> thickness at less than 0.5um, it is generally used as a solderability
> protective finish for flatness.
>
>
> Jeffrey A McGlaughlin, CID
> Engineering Designer
> Battelle Memorial Institute
> Columbus Ohio
> <http://www.battelle.org/>
> [log in to unmask]
>
> -----Original Message-----
> From: Victor Hernandez [mailto:[log in to unmask]]
> Sent: Tuesday, May 13, 2003 2:08 PM
> To: [log in to unmask]
> Subject: [TN] Printed Wire Board / Printed Circuit Board and Options
> Cards - G old Finger Thickness Round Robin Test
>
>
>
> Fellow TechNetters,
>
> I did not receive any viable leads on my initial topic of
> inquiry. Therefore, I have restated my inquiry to see if some
>
> one will response this time. With cost cutting ventures from
> overseas I see product with Gold Finger thickness in
> LOW range of 2 - 3 microns. My concern here is the wear ability
> factor and is the consumer aware of these facts.
> I also hear of SOFT / HARD / FLASH GOLD. Where can I find
> information on what
> ONCE UPON A TIME INDUSTRY STANDARD.
>
> Victor,
>
> -----Original Message-----
> From: Hernandez, Victor G
> Sent: Wednesday, July 24, 2002 8:16 AM
> To: [log in to unmask]
> Subject: Gold, Soft/Hard, Insertion Documentation
>
> Follow Tec Netters,
>
> Where can I locate information on insertion documentation for
> hard and soft gold.
>
> Victor G. Hernandez
> Component/Material Failure Analysis Eng.
> PS4-1, Rm. 132
> Ofc: 512-725-3471
> Pgr: 512-907-0005
>
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