This one is also available on-line.
On http://www.smtinfo.net/search/search.pl?Match=2&Terms=soldering+to+gold
you'll find this article, plus a few others.
Daan Terstegge
http://www.smtinfo.net
----- Original Message -----
From: "Howard Watson" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, May 13, 2003 11:01 PM
Subject: Re: [TN] ENIG reflow profile vs HASL
> Chris,
>
> There is a really good article in the April 1998 Circuits Assembly:
Soldering to Gold: A Practical Guide, by Ronald A. Bulwith that describes
the considerations when soldering to
> gold finishes, and if you're a magazine packrat like me, you may have this
> issue laying around! It emphasizes what the other members have already
> said, plus it addresses some other issues related to this subject.
>
> Howard Watson
> SMT Manufacturing Engineer
> AMETEK/Dixson
>
>
>
>
> Chris Murphy <[log in to unmask]>
> Sent by: TechNet <[log in to unmask]>
> 05/12/03 05:32 PM
> Please respond to "TechNet E-Mail Forum."; Please respond to Chris Murphy
>
>
> To: [log in to unmask]
> cc:
> Subject: [TN] ENIG reflow profile vs HASL
>
>
> Hi Technetters,
>
> looking through the Technet archives on the differences between HASL and
> ENIG
> boards, I notice that higher temeperatures are required for soldering ENIG
> boards.
>
> Presumably this is because the gold layer firstly has to be dissolved, and
> we are
> dealing with a Ni/Sn intermetallic rather than a Cu/Sn intermetallic.
>
> Does anyone have any recommendations on what differences have to be made
> to the
> reflow profile (e.g. different times above 183 deg C or 200 deg C)? Or
> can the same
> profile be used for the same board regardless of whether it is HASL or
> ENIG?
>
> Thanks in advance for any replies.
>
> Regards,
>
> Chris Murphy,
> Production Engineering,
> Tait Electronics
>
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