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Reply To: | (Leadfree Electronics Assembly Forum) |
Date: | Wed, 21 May 2003 08:15:24 +1200 |
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Robin:
Two excellent articles on the web (somewhere) 'Annotated Tin Whisker Bibliography, Dr George T Galyon (IBM Server group) ie whiskers caused by compression
forces ... and 'No Clean and Lead Free', Dr Helmut, ZESTRON (www.zestron.com) ie dendrite growths with Ag rich solders.
Cheers
Robert
"Fites, Robin" wrote:
> Are 100% tin coatings more susceptible to dendritic growth than tin/lead
> alloys? I have seen a lot of information about increased chances of tin
> whiskers with pure tin but I haven't seen any information on dendritic
> growth. Are pure tin coatings more likely to form the branchlike growth in
> with humidity and applied voltage than the alloyed tin?
>
> Robin Fites
> Principal Materials Engineer
> Harman/Becker Automotive Systems
>
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