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Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 30 May 2003 16:08:27 -0500 |
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Bev,
I don't recall seeing any statements verbatim to what you've described below
but see section 6.3.1 (Fig. 6-6) of A610 Rev. C and section 9.2.5.1 of
J-STD-001C. These sections do talk about allowable solder depression (up
to a maximum of 25%). But I would also recommend finding out what type of
environment the assembly will end up in. High vibratory and/or thermal
shock environments may need further review before stating that such solder
depression is okay. Hope this helps.
Rich Lasko
Badger Electronics
-----Original Message-----
From: Bev Christian [mailto:[log in to unmask]]
Sent: Friday, May 30, 2003 3:49 PM
To: [log in to unmask]
Subject: [TN] PTH Hole Fill
Technetters,
Someone in our company is quite sure "there was a relaxation of solder fill
when and if the lead of the component was not sufficiently large enough
compared to the PTH to which it was soldered". I have no recollection of
such a change in A610. But the maybe some of my brain cells are on vacation.
Can anyone comment on the statement about hole fill, please? Thanks.
Bev Christian
Research in Motion
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