Carrie, the only difference to me would be that sodler deposits don't get
in the way of future component population whereas adhesive does. Otherwise,
I agree with you entirely - where do yu draw the line about inclusion or
not of process materials.
Peter
"Morse, Carrie" <[log in to unmask]> 15/05/2003 01:24 AM
Sent by: TechNet <[log in to unmask]>
Please respond to "TechNet E-Mail Forum."; Please respond to "Morse,
Carrie"
To: [log in to unmask]
cc: (bcc: DUNCAN Peter/Asst Prin Engr/ST Aero/ST Group)
Subject: Re: [TN] Adhesive where no component is loaded...
Steve, Steve, Steve.
You know....there's always ONE in the crowd. We had a saying in school ---
"There's a Derek in every Class".
This saying is not meant to offend anyone with the name Derek, but, first
semester freshman class we had
this guy named Derek who just would not let it go. This poor guy is
probably dead from high blood pressure by now!
Anyway....In addition to letting your inspector know that epoxy is not part
of the BOM, let her know that
solder paste is not always part of the BOM. Let her know that many times
solder paste is put down at
"No-Insert" locations. Ask her why THAT is OK and not the epoxy?
Another piece of info that would be interesting is that quite often, board
assembly houses put EXTRA dots on the
board (typically on the rails, but, if no rails, then on the board) to show
that the nozzle did not clog during
glue deposition. Usually there will be an extra two or more dots somewhere
on the board.
And what about Silk Screen bleeding? Have you ever seen a perfectly Silk
Screened Letter? Should we start
rejecting boards at incoming because there is just a bit too much ink on
the letter "U"?
But, with all that put aside, my approach would be that excess epoxy is NOT
identified in the IPC spec as a defect
under these conditions. I would of course let her know that her attention
to quality is quite exceptional, but, that in this case, section 12.1 does
not identify excess epoxy under these conditions as a defect.
Good luck and keep smiling (kill 'em with kindness!)
-Carrie
-----Original Message-----
From: Steve Gregory [mailto:[log in to unmask]]
Sent: Wednesday, May 14, 2003 12:28 PM
To: [log in to unmask]
Subject: [TN] Adhesive where no component is loaded...
Hi All!
The fun never ends...
I've been involved in a rather heated (albeit silly, I think...)
debate with an inspector here, about adhesive being deposited where
there is no component loaded.
As you may surmise from my posts over the past few days, I stencil
epoxy, not dispense. For some reason, the issue has come up with one
of my inspectors here, requesting that I get something in writing
from our customer saying that it's okay to have epoxy deposits at
locations where there is no component loaded. I told her that I
wasn't going to do it because I didn't want to look silly asking our
customer if it was okay to have a glue dot at a location that's not
loaded.
Her reasoning is that we're putting something on the board that's not
being called out on the bill of material. My response is that the
epoxy isn't called out anyway, but we have to use it to be able to
process this board that has PTH and SMT on the bottom. "But there's
no component there, so there shouldn't be any glue there." was her
response. "But it doesn't make any difference, it's a non-issue" I
calmly replied.
We've been debating this for 2-days now, and I'm about at my wits
end. There's nothing in the -610 or the J-STD-001 that says it's
defect, or that it's forbidden to deposit epoxy where a component
isn't loaded, and there's nothing in the documentation from our
customer to keep the unused areas free from epoxy. I've already spent
much more time on this issue than I ever thought I would. Why this
issue has popped-up now, I don't have a clue. Me thinks it's much ado
about nothing.
What is your take on this issue?
-Steve Gregory- ---------------------------------------------------
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